ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,466, issued on July 21, was assigned to MACOM Technology Solutions Holdings Inc. (Lowell, Mass.). "Solderable and wire bondable part markin... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,467, issued on July 21, was assigned to CR Runan Technologies (Chongqing) Co. Ltd. (Chongqing, China). "Semiconductor packaging method" was... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,468, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Ja... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,469, issued on July 21, was assigned to NXP USA Inc. (Austin, Texas). "Packaged semiconductor device, leadframe and method for improved bon... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,470, issued on July 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit package with multiple interconnects" was inven... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,471, issued on July 21, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device for upper and lower arm circuits" was inven... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,472, issued on July 21, was assigned to Littelfuse Semiconductor (Wuxi) Co. Ltd. (Wuxi, China). "Package structure assembly for TVS devices... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,473, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having dummy pads and ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,474, issued on July 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring substrate, semiconductor device, and m... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,475, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Lithography pillar process for embedded bridge scaling" was inv... Read More